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●This product uses imported raw materials that are resistant to high temperatures and pressures, never produce oil, and meet the process requirements of flexible circuit board lamination. It is a professional consumable for flexible circuit boards.
●It has rapid and uniform heat conduction, improving circuit board quality, increasing production efficiency, saving energy, and reducing costs.
●It has good cushioning and resilience, avoiding scratches caused by hard contact between the heating plate and the laminating plate, and extending the service life of the heating plate and the laminating plate. The hot-press silicone sheet is a product with high thermal conductivity, cushioning, and insulation characteristics. It has excellent thermal conductivity, high temperature resistance, pressure resistance, and extremely high resilience.
Product Applications:
1. Suitable for hot-press bonding processes (FOG, COG, TAB, hot-press conductive film, flexible circuit boards, ITO conductive glass, etc.) of various displays (TP, TN, TFT, OLED). It is placed on the bottom surface of the hot-press head, providing a conductive buffering effect for temperature uniformity, isolating the hot-pressed product from direct contact with the hot-press head, and providing anti-static leakage protection.
2. Thermal conduction of insulating semiconductors. 3. Buffering, heat conduction, and sealing for aerospace equipment and high-end devices.
Product Features:
1. Extremely high thermal conductivity, heat resistance, and buffering capacity, preventing damage to FPC, glass, etc.
2. Excellent thermal stability and consistent pressure resistance.
3. Extremely high resilience and non-adhesive properties; powder-free surface; no oil seepage.
Product Specifications:
1. Product models are SIC-HG, SIC-HH, and SIC-HB (black).
2. Common thicknesses are 0.2~0.45mm, lengths are 5~100mm, and widths are 5~580mm. Custom lengths and widths are available upon request.